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Mils 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62.

• Pitch 48mm length 40mm diameter 16mm.
• Wifi Footprint for Mini-Circuits.
• Normal 0.468222 0.88192 0.0546261 facet.

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