Labels Milestones
BackAR Path="/607ED812/60C3833D" Ref="R21" Part="1" AR Path="/607ED812/609384DB" Ref="#FLG0102" Part="1" AR Path="/607ED812/60A9C096" Ref="R24" Part="1" AR Path="/607ED812/60C38343" Ref="R12" Part="1" AR Path="/607ED812/60802BB2" Ref="R31" Part="1" AR Path="/607ED812/60C38349" Ref="R23" Part="1" AR Path="/607ED812/60C38343" Ref="R22" Part="1" From 3d279dd88cba890e1ff05b6fd01cb5480b1f325e Mon Sep 17 00:00:00 2001 45c41b9873 Go to file 6523065365 updates the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfn/05081595_0_lqfn16.pdf), generated.
- -0.881923 0.0546202 vertex 6.73225.
- Hardware/PCB/precadsr/ao_tht.pretty/Molex_KK-254_AE-6410-03A_1x03_P2.54mm_Vertical.kicad_mod Normal file View File 3D Printing/Cases/Eurorack Modular.