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Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils.

• "Notes": "Layer B.SilkS" ; DRILL file.
• 5.870062e-001 facet normal -0.469113.
• Switch Wurth Wuerth Ultraminiature Surface Mount Double Row.
• 0.375mm height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf USON, 14.
• -1.637712e-15 -2.848846e-16 -1.000000e+00 facet normal.

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