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HLE-144-02-xxx-DV-A, 44 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP56: plastic thin shrink small outline package; 10 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [QFN] with corner pads and trace routing.

-0.989357 0.108179 facet normal.
//title test module label(string, size=4, halign="center", font=default_label_font.
0.76849 -0.630641 0.108235 facet normal.
0.768293 0.115323 facet normal.

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