3
1
Back

Pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 3 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator connector Hirose DF63 through hole, DF13-11P-1.25DSA, 11 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41791-0010 example for new mpn: 39-30-0040, 2 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 32 pins, through hole 4.5mm, height 1.

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