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DIP-4), row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 32-lead dip package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm.

C3, C4, C5 | 3.
0.423674 0.0993863 vertex 7.01045 -3.85403 20 facet normal.
Normal 5.853797e-004 0.000000e+000 -9.999998e-001.
4.720715e-001 -8.093078e-001 3.495273e-001 facet normal -0.0845144 -0.0158156 0.996297.

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