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TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, MINIMOLD package, see https://www.vishay.com/docs/82493/tsop311.pdf package for Everlight ITR8307 with PCB locator, 4 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, BM10B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator connector wire 0.127sqmm double-strain-relief Soldered wire connection, for 2 times 0.25 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST XH series connector, SM02B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, S15B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF63R-5P-3.96DSA, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0161, 16 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-03P-1.25DS, 3 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0230, 23 Circuits (http://www.molex.com/pdm_docs/sd/5022502391_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 5, Wuerth electronics 9774040243 (https://katalog.we-online.de/em/datasheet/9774040243.pdf), generated with kicad-footprint-generator Inductor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from.

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