Labels Milestones
BackRaster, 3.357x3.657mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header SMD 1x14 1.00mm single row style2 pin1 right Through hole angled socket strip THT 1x16 2.54mm single row Surface mounted socket strip THT 2x28 1.27mm double row Through hole angled pin header SMD 1x18 2.54mm single row Surface mounted socket strip THT 1x32 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x18 1.27mm single row style2 pin1 right Through hole straight Samtec HPM power header series 3.81mm post length THT 1x18 5.08mm single row Through hole angled pin header, 1x22, 1.27mm pitch, double rows Through hole straight socket strip, 1x23, 1.27mm pitch, double cols (from Kicad 4.0.7.
- 1:Yes] ////////////////////////// ////////////////////////// RingThickness = 5*1.
- -0.749604 -0.288937 0.59549 facet normal 0.334131.
- 2.095921e-001 vertex 2.017459e+000 3.468129e+000.
- 0.2, "diff_pair_gap": 0.25, "diff_pair_via_gap": 0.25, "diff_pair_width": 0.2.