Labels Milestones
BackSMD JPin SMD 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package.
- 236-106, 45Degree (cable under 45degree), 36 pins, pitch.
- Vertex -0.932982 -7.19919 7.41293 vertex.
- Strip, HLE-147-02-xxx-DV-BE-A, 47 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- 5.8mm Fastron HBCC Inductor.