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LEA top entry JST PH series connector, S11B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DC6 Package; 6-Lead Plastic Dual Flat, No Lead Package (UC) - 3x3x0.5 mm Body [HTSSOP], with thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2018-6.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xx-DV-TE, 43 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0140, 14 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Molex MicroClasp horizontal Molex MicroClasp Wire-to-Board System, 55935-0930, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 11, Wuerth electronics 9774020243 (https://katalog.we-online.de/em/datasheet/9774020243.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2038, 3 Pins per row, Mounting: PCB Mounting Flange (http://www.molex.com/pdm_docs/sd/039291047_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-10DP-2DSA, 5 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST VH top entry Molex FFC/FPC connector, FH12-28S-0.5SH, 28 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf SIP4 Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf Footprint for Mini-Circuits case MMM168, Land.

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