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Printing/Panels/Radio_shaek_standoff.stl create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_LED_Hole.kicad_mod delete mode 100644 Hardware/PCB/precadsr/potsetc.sch create mode 100644 3D Printing/Rails/36hp_outie.stl create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Jack_Hole.kicad_mod create mode 100644 Schematics/SynthMages.pretty/6.3mm_NPTH_MAXJLCPCB.kicad_mod create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Switch_Hole.kicad_mod create mode 100644 Hardware/PCB/precadsr/precadsr.sch create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Pot_Hole.kicad_mod delete mode 100644 Envelope/Envelope.kicad_pro create mode 100644 Fireball/Fireball_panel.kicad_pcb 2666d5803f Footprint selection, some PCB layout choices From c6741b48f0ef8a6e69ecbca1a47bc4f4b481e2a3 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Experimenting with more panel layout 3bfacc0b86 Add main pdf Add main pdf Add main pdf a924f97182 Minor layout tweaks Based on designs from: Skull & Circuits (https://www.skullandcircuits.com/vca-1-2/ - Moritz Klein (https://www.ericasynths.lv/shop/diy-kits-1/edu-diy-vca/ - Two CV inputs for each, one primary and one with an eye towards doing it all in one module with integral chip antenna (http://ww1.microchip.com/downloads/en/DeviceDoc/60001380C.pdf Cypress EZ-BLE PRoC Module (Bluetooth Smart) 21 Pin Module Digi XBee SMT RF ESP WROOM-02 espressif esp8266ex 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf NINA-B111 LGA module 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 42-lead though-hole mounted.

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