synth_tools

Back

Coil inductor Murata LQH2MC Inductor, SMD, 5.7x5.0x4.7mm, https://search.murata.co.jp/Ceramy/image/img/P02/JELF243A-0045.pdf Neosid, Air-Coil, SML, 6-10turn, HDM0431A-HDM1031A, Neosid Air-Coil SML 2turn HAM0231A Neosid, Air-Coil, SML, 6-10turn, HDM0431A-HDM1031A, Neosid Air-Coil SML 5turn HDM0531A Neosid, Air-Coil, SML, 2turn, HAM0231A, Neosid Air-Coil SML 4turn HAM0431A Neosid, Air-Coil, SML, 5turn, HDM0531A, Neosid Air-Coil SML 4turn HDM0431A Neosid, Air-Coil, SML, 6-10turn, HDM0431A-HDM1031A, Neosid Air-Coil SML 2turn HAM0231A Neosid, Air-Coil, SML, 4turn, HAM0431A, Neosid Air-Coil SML 3turn HDM0331A Neosid, Air-Coil, SML, 2turn, HAM0331A, Neosid Air-Coil SML 6-10turn HAM0631A-HAM1031A Neosid, Air-Coil, SML, 5turn, HDM0531A, Neosid Air-Coil SML 6-10turn HAM0631A-HAM1031A Neosid, Air-Coil, SML, 2turn, HAM0331A, Neosid Air-Coil SML 6-10turn HDM0431A-HDM1031A Neosid, Air-Coil, SML, 5turn, HDM0531A, Neosid Air-Coil SML 6turn HAM0631A Neosid, Micro Coil, Inductor, Ms36-L, SMD, Fixed inductor, SMD, magnetically shielded, https://neosid.de/import-data/product-pdf/neoFestind_ma_SMs85.pdf Neosid Inductor SM-NE127 Fixed inductor SMD magnetically shielded Inductor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0080, 8 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2021, 2 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for a single 1.5 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wires, basic insulation, conductor diameter 2mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, 78171-0005 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body.

New Pull Request

Labels Milestones