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Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header THT 2x30 2.00mm double row Through hole socket strip THT 1x22 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x19 2.54mm single row style2 pin1 right Through hole angled pin header, 2x06, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 3.81mm post length THT 1x08 2.54mm single row Through hole straight pin header, 1x07, 2.00mm pitch, double rows Surface mounted socket strip SMD 1x05 1.27mm single row Through hole angled socket strip, 2x40, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole pin header THT 2x11 1.27mm double row Through hole angled socket strip, 1x36, 2.54mm pitch, single row Surface mounted socket strip SMD 2x26 2.54mm double row Through hole socket strip SMD 1x16 2.54mm single row style2 pin1 right Through hole angled pin header THT 2x18 1.27mm double row Through hole angled socket strip, 2x33, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0.

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