Labels Milestones
Back(LZ) - 2x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST .
New Pull Request