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Ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ ord*cos(lf1), ord*sin(lf1), h1], [ ird*cos(lf2), ird*sin(lf2), h1], [ 0,0,h2], Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm.

26-60-5130, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
-0.586535 -0.665684 0.461347 facet.
-1.065156e+02 9.665134e+01 1.020829e+01 vertex -1.052246e+02 9.725134e+01 1.070702e+01.

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