3
1
Back

...gson_DG301_1x03_P5.00mm_Vertical.kicad_mod | 63 ...Block_dinkle_pluggable_2_P5.00mm.kicad_mod | 38 .../SOT-23_Handsoldering.kicad_mod | 38 .../ao_tht.pretty/Wall_wart_A-4118.kicad_mod | 28 .../ao_tht.pretty/analogoutput.kicad_mod | 213 .../ao_tht.pretty/analogoutput_12mm.kicad_mod | 210 Hardware/PCB/precadsr/fp-lib-table | 1 | 10nF | Ceramic capacitor | | | | J8 | 1 | B10k | Potentiometer | | | R2, R5 | 2 .../Unseen Servant/Unseen Servant.kicad_prl | 2 pin Molex header 2.54 mm spacing 3 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 16 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch Vertical 215079-8 7-215079-8 USB 3.0, type A, right angle, http://www.ckswitches.com/media/1428/os.pdf 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab.

New Pull Request