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(http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight pin header, 1x16, 1.00mm pitch, single row Surface mounted pin header THT 1x33 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x38 1.27mm single row style2 pin1 right Through hole straight pin header, 2x01, 2.00mm pitch, double rows Surface mounted socket strip THT 1x12 5.08mm single row Surface mounted socket strip SMD 1x38 2.54mm single row Surface mounted socket strip THT 2x03 2.00mm double row Through hole pin header THT 1x29 1.00mm single row Through hole angled pin header SMD 1x40 1.27mm single row Through hole angled pin header THT 2x23 2.54mm double row Through hole straight socket strip, 2x13, 1.27mm pitch, single row Surface mounted pin header SMD 1x25 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x05 1.00mm double row Through hole socket strip THT 2x06 1.27mm double row Through hole pin header THT 1x13 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x25 2.54mm single row Through hole angled socket strip SMD 2x22 2.54mm double row Through hole straight Samtec HPM power.

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