3
1
Back

Package (MD) - 4x4x0.9 mm Body [QFN] with thermal pad with vias HTSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc8246.pdf#page=263), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-116-02-xxx-DV, 16.

New Pull Request