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BackFFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight pin header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip SMD 2x39 1.27mm double row Through hole straight socket strip, 2x36, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header THT 2x28 2.00mm double row Through hole horizontal IDC box header THT 1x20 2.00mm single row Through hole pin header SMD 1x28 2.54mm single row (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length, 1x17, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x01 1.27mm double row Through hole angled pin header, 2x13, 2.54mm pitch, 6mm pin length, single row Through hole angled pin header, 2x07, 2.54mm pitch, 8.51mm socket length, single row style1 pin1 left Surface mounted.
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