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HLE-130-02-xx-DV-TE, 30 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP, 112 pins, 20mm sq body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 14-Lead Plastic Dual Flat No-Lead Package, 9x9mm Body (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x32, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x27 1.27mm single row style1 pin1 left Surface mounted socket strip THT 1x33 1.27mm single row Through hole angled pin header THT 2x25 2.00mm double row surface-mounted straight socket strip, 2x04, 2.54mm pitch, 6mm pin length, single row Through hole straight socket strip, 2x13, 1.27mm pitch, double rows Through hole angled pin header, 1x26, 2.54mm pitch, double cols.

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