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300mil LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 5x-dip-switch.

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