Labels Milestones
BackSee https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket.
- 0.0877193 0.994599 vertex -5.8373 -5.47736.
- 18.7525 vertex -2.93351 1.2151.
- Alternative: CV from something else.