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EuroQuartz XO32 series, http://cdn-reichelt.de/documents/datenblatt/B400/XO32.pdf, hand-soldering, 3.2x2.5mm^2 package SMD Crystal Qantek QC5CB, https://www.qantek.com/tl_files/products/crystals/QC5CB.pdf crystal Epson Toyocom FA-128 (https://support.epson.biz/td/api/doc_check.php?dl=brief_FA-128&lang=en), 2x1.6mm^2 package Diode SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline (SS)-5.30 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils SMD DIP Switch SPST Slide 5.9mm 232mil SMD 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 15.24.

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