Labels Milestones
BackStackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes.
- TSSOP HTSSOP 0.65 thermal pad LQFP, 32 Pin.
- HSOP 11.0 x 15.9mm Pitch.
- -9.2078 1.51264 facet normal -8.191610e-001.
- (http://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 20 Pin.
- HLE-106-02-xx-DV-TE, 6 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py.