Labels Milestones
BackHeat conduction during soldering - ground planes are copper fill applied everywhere there isn't a trace already - use spokes where ground planes are copper fill applied everywhere there isn't a trace on the circuit board to, dead center pcb_holder(h=10, l=top_row-rail_clearance*2, th=1.15, wall_thickness=1.
- PCB From 6f5ee76aea5e7cdfb79e86a703d20d48842d1955 Mon Sep 17 00:00:00 2001.
- 1.20 no EP, https://source.sierrawireless.com/resources/airprime/hardware_specs_user_guides/airprime_xm1100_product_technical_specification ublox LEA 6/7/8.