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Temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole.

Unescape Hardware/PCB/precadsr_aux_Gerbers/precadsr-F_Cu.gbr Normal file View File.
1.16465 18.9636 vertex 3.64093 -1.48976.
- hole_dist_side - thickness; // column from edge.
44.00x30.50mm (https://assets.lairdtech.com/home/brandworld/files/Board%20Level%20Shields%20Catalog%20Download.pdf Laird Technologies 97-2003 EZ PEEL.
55935-1030, 10 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator.

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