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Reed switch K switch normally-open pushbutton push-button LCD D MEC 5E single pole normally-open tactile switch D Single Pole Single Throw (SPST) switch, small symbol D 5x DIP Switch, Single Pole Single Throw (SPST) switch, small symbol D 9x DIP Switch, Single Pole Single Throw (SPST) switch D Switch, three position, dual pole double throw, illuminated paddle, http://www.nkkswitches.com/pdf/gwillum.pdf switch single-pole double-throw spdt ON-ON D Screw terminal, single row, 01x03 D 2x5 pin shrouded header 2.54 mm spacing | | | | | | S1 | 1 C10, C14 too small for film; is film needed? - Smaller cap (476nF?) for C1 - Ceramic 104s for C10, C14, might be fine, might introduce intermittents From c96644890cf0985bb0d02bb542ef75a0a00d53f2 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Added hard sync to schematic, laid out PCB with exploratory 8hp layout PSU/Synth Mages Power Word Stun.kicad_prl main VCA/README.md 9 lines main MK_VCO/Schematics/MK_VCO_RADIO_SHAEK_try2_ground_rail.diy 8102 lines E-Switch sub miniature slide switch, OS series, SPDT, https://www.e-switch.com/wp-content/uploads/2022/06/EG.pdf tactile switch, 7.3mm x 6.25mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4x4mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball.

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