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Locator, 12 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator JST XH series connector, 501331-0907 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flatpack No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 10-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic Stretched Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Small Outline (ST)-4.4 mm Body [QFN]; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 7x7mm package, pitch 0.8mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 3.693x3.815mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP Switch SPST Slide 7.62mm 300mil SMD 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST Copal_CHS-06A, Slide, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 10.8x14.26mm 5x-dip-switch SPST KingTek_DSHP05TJ, Slide, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm, thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for.

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