Labels Milestones
BackUFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 2.965x2.965mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 480, 4.57x4.37mm, 132.
- Orange, common anode, 7.62x7.62mm.
- Oatmeal initial 2015-04-27 01:31:45 -07:00 From 2eebdf7ecf422fd634dd8afc69d23956ae0ebfdc.
- 0.463226 7.17947 facet normal -0.290283 0.956941 0.
- 1553 No commits in common.