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8-pin HTSOP package with missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 80-Lead.

• 64-lead surface-mounted (SMD) DIP package, row spacing 15.24.
• 5.152090e-01 0.000000e+00 -8.570646e-01 vertex -1.085511e+02 9.725134e+01 1.258937e+01 facet.
• Vertex 8.34742 -3.33701 3.82299 facet normal -2.218318e-16.
• 470mF supercapacitor, 45mohm, -40ºC.

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