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Dodgy url but was the only at hand), DCDC-Converter BOTHHAND Type CFxxxx-Serie DCDC-Converter, CINCON, EC6Cxx, dual or tripple output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/C%20CASE/SPEC-EC6C-V12.pdf DCDC-Converter CINCON EC6Cxx single output Power Module uPOL MUN12AD03 Meanwell DCDC non-isolated converter SIP module, http://www.meanwell.com/webapp/product/search.aspx?prod=nid30 Isolated 1W or 2W Single Output SM DC/DC Converters 78sr3.3 78sr5 78sr9 78sr12 78srXX DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, package size 62x19.5x14mm, https://silvertel.com/images/datasheets/Ag5400-datasheet-high%20Efficiency-30W-Power-Over-Ethernet-Plus-Module-PoE+PD.pdf DCDC-Converter Silvertel Ag5810 single output DC/DC Murata MGJ2DxxxxxxSC, 19.5x9.8x12.5mm, 5.2kVDC Isolated, 1W, single output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf Abracon Miniature Ceramic Smd Crystal ABM10 http://www.abracon.com/Resonators/ABM10.pdf SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator Fuse SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Infineon, PG-TISON-8-2, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-4/ Infineon, PG-TISON-8-5, 8x8x1.1mm, 1mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-5/ VML0806, Rohm (http://rohmfs.rohm.com/en/techdata_basic/transistor/soldering_condition/VML0806_Soldering_Condition.pdf, http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf MicroCrystal C3 2.5x3.7mm, https://www.microcrystal.com/fileadmin/Media/Products/RTC/Datasheet/RV-1805-C3.pdf SON, 8 Pin (https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=34), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0510, with PCB locator, 13 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator connector wire 0.75sqmm double-strain-relief Soldered wire connection, for 3 times 0.75 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E.

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