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1.854mm thermal pad HTSSOP32: plastic thin shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC MS-012AC.

• -0.714669 -0.586516 0.381113 facet normal 0.29018 0.0285785.
• -0.491815 0.771499 vertex -7.11876 4.7566 5.56266 facet.
• 90814-0014, 14 Pins per.

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