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G6K-2P-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Relay Omron G6S-2, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6s.pdf Panasonic Relay SPDT, Finder Type34.51, horizontal form, see https://gfinder.findernet.com/public/attachments/34/EN/S34USAEN.pdf Hamamatsu spectrometer, see http://www.hamamatsu.com/resources/pdf/ssd/c12880ma_kacc1226e.pdf 3.2mmx2.7mm, light sensor, i2c interface, 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN ambient light sensor chipled Broadcom DFN, 6 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/MAX4460-MAX4462.pdf#page=19, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0137.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, B38B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (5mm x 3mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 20 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=43), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-20DS-0.5V, 20 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (JEDEC MS-013AF, https://www.analog.com/media/en/package-pcb-resources/package/54614177245586rw_14.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf (page 45)), generated with kicad-footprint-generator Molex PicoBlade series connector, 202396-1107 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 6, Wuerth electronics 9775096360 (https://katalog.we-online.com/em/datasheet/9775096360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (JEDEC MO-153 Var EC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-170 , 10 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.15 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Harting har-flexicon series connector, BM17B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-108-02-xxx-DV-A, 8 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator TE, 3-826576-6, 36 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator TE, 826576-6, 6 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator JST XA series connector, 202396-1307.

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