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Plastic DFN, 4mm x 3mm MLF - 3x3x0.85 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf MSOP, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/6957fb.pdf#page=36), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 4 Pin (http://www.ixysic.com/home/pdfs.nsf/www/CPC1017N.pdf/$file/CPC1017N.pdf), generated with kicad-footprint-generator JST EH series connector, 202396-1407 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator JST PHD series connector, B11P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 20 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1711.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 1206 (3216 Metric), reverse mount, square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2102, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator connector wire 0.25sqmm strain-relief Soldered wire connection, for 6 times 2 mm² wire, reinforced insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip.

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