Labels Milestones
BackSimulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes count 16 ============================================================= Total unplated.
- 0.852093 11.3704 0.18985 facet normal -0.112087 -0.551317.
- HTSSOP, 14 Pin (http://www.ti.com/lit/ds/symlink/tlv9004.pdf#page=64.