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48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x21.88mm 8x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm.

0.288339 0.956937 0.0336393 facet normal 4.077547e-001 -6.994078e-001 5.869964e-001.
.../precadsr-panel-CuTop.gtl | 970 .../precadsr-panel-EdgeCuts.gm1 | 26 .
-0.41258 -6.33525 7.82405 facet normal -0.124395.
WSON 8 1EP ThermalVias WSON, 8 Pin.

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