Labels Milestones

Back

16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil.

• Case 15.2x15.2mm, pitch 10.9mm.
• Sot505-1_po.pdf TSSOP, 8 Pin (https://www.winsen-sensor.com/d/files/me2/mems--gm-402b--manual-v1_1.pdf Omnidirectional, -42dB.
• 0.929891 facet normal 9.289224e-001 3.702745e-001 -0.000000e+000 vertex 4.344010e+000.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects