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B20B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 80 Pin (JEDEC MO-153 Var JC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1110, with PCB locator, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP28: plastic thin shrink small outline package; 10 leads; body width 4.4 mm (see NXP sot054_po.pdf TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (https://www.holtek.com/documents/10179/116723/sop20-300.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xxx-DV-BE-A, 22 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-104-02-xxx-DV-LC, 4 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf#page=23), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN.

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