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Outline package; 40 leads (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads molded, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator connector JST VH series connector, B18B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 8 leads; body width 4.4 mm; thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, staggered type-2 TO-220F-11, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 10.9mm TO-264-3, Horizontal, RM 2.54mm, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.7mm staggered type-2 TO-220F-5 Vertical RM 2.54mm TO-220F-3, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-2 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220F-4, Vertical, RM 1.27mm, staggered type-2 TO-220F-15, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 1.27mm staggered type-1 TO-220-5, Horizontal.

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