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Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 42-lead.

• -6.08298 -7.91194 0.0389647 facet normal -9.062902e-001 -5.070952e-003 4.226256e-001.
• Retriggering input, allowing additional attack/decay.
• 8x9 raster, 3.767x4.229mm package.
• Inductor WE-PD TypLS Wuerth Shielded.

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