Labels Milestones
Back(7361-38 Metric), IPC_7351 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-30DS-0.5V, 30 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py AMS OLGA, 8 Pin (http://www.ti.com/lit/ds/symlink/lp2951.pdf#page=27), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0730, 7 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502443-0770 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-103-02-xxx-DV-LC, 3 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator JST PHD series connector, B02B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Capacitor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.25 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-105-02-xxx-DV-LC, 5 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole IDC header, 2x05, 2.00mm pitch, 4.2mm pin length, single row style2 pin1 right Through hole angled socket strip SMD 1x02 2.54mm single row Through hole angled socket strip SMD 2x05 2.00mm double row Through hole angled pin header, 2x37, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header, 1x17, 1.00mm pitch, 2.0mm pin length, single row Through hole straight pin header, 2x04, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x13 1.27mm double row Through hole pin header THT 1x33 2.00mm single row Through hole vertical IDC box header, 2x08, 2.54mm pitch, double rows Through hole horizontal IDC header THT 2x08 2.54mm double row Through hole angled pin header THT 1x02 1.00mm single row Through hole angled socket strip, 1x04, 2.00mm pitch, 4.2mm pin length, single row style1 pin1 left Surface mounted pin header SMD 2x14 2.54mm double row Through hole pin header SMD 2x08 1.27mm double row Through hole pin header SMD 1x38 2.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x25 2.00mm single row Through hole angled pin header, 2x20, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x16 2.54mm single row style1 pin1 left Surface mounted pin header.
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