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215079-6 7-215079-6 TE-Connectivity Micro-MaTch Vertical 215079-4 7-215079-4 TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 8 pin SIM connector for PCB's with 08 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 30 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 05 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (not polarized Highspeed card edge connector for PCB's with 30 contacts (not polarized Highspeed card edge connector for PCB's with 05 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 30 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 60 contacts (polarized conn samtec card-edge socket high-speed 0.8 mm Highspeed card edge connector for PCB's with 60 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 60 contacts (not polarized Highspeed card edge connector for PCB's with 30 contacts (not polarized Highspeed card edge connector for PCB's with 30 contacts (polarized Highspeed card edge connector for PCB's with 20 contacts (polarized Highspeed card edge connector for PCB's with 40 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 50 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (not polarized Highspeed card edge connector for PCB's with 30 contacts (polarized conn samtec card-edge socket high-speed 0.8 mm BGA-64, 10x10 raster, 4.775x5.041mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.5mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YZR pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition.

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