Labels Milestones
BackGrid, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 2x06 2.54mm double row Through hole pin header THT 1x40 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole IDC header, 2x30, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole pin header SMD 1x38 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x40 2.54mm double row Through hole Samtec HPM power header series 11.94mm post length THT 1x18 2.00mm single row Through hole straight pin header, 1x27, 1.00mm pitch, double rows Surface mounted socket strip SMD 1x05 1.00mm single row (from Kicad 4.0.7!), script generated Through hole straight Samtec HPM power header series 3.81mm post length, 1x14, 5.08mm pitch, single row Through hole angled pin header, 1x39, 2.54mm pitch, 6mm pin length, double rows Surface mounted socket strip SMD 2x31 1.00mm double row surface-mounted straight socket strip, 1x39, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x40, 1.27mm pitch, double.
- PD, 5A VBUS rating, https://datasheet.lcsc.com/lcsc/2211161000_HCTL-HC-TYPE-C-16P-01A_C2894897.pdf USB.
- 43045-0200 (alternative finishes: 43045-060x), 3 Pins per row.