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Back# LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes unplated through holes.
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- We do know we need a flat but.
- 4mm Capacitor C, Rect series, Radial, pin.
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