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M5, ISO14580 mounting hole 5mm no annular Mounting Hole 6.4mm, M6, ISO14580 mounting hole 3.7mm no annular m6 din965 Mounting Hole 2.2mm, M2, ISO14580 mounting hole 2.7mm no annular Mounting Hole 6.4mm, M6, DIN965 mounting hole 2.2mm m2 iso7380 Mounting Hole 5mm, no annular Mounting Hole 2.7mm, no annular, M4 mounting hole 4.3mm no annular m2 din965 Mounting Hole 2mm, no annular m2.5 iso7380 Mounting Hole 6.4mm, M6, DIN965 mounting hole 5.3mm no annular m4 din965 Mounting Hole 5.3mm, no annular, M2.5, ISO7380 mounting hole 4.3mm no annular mounting hole position tweaks f6c7924538 Messing around with panel title fonts Panels/Font files/Quentincaps.ttf create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Panel_Dual_Slotted_Mounting_Hole.kicad_mod delete mode 100644 Synth_Manuals/LABOR_MANUAL.pdf create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/PinHeader_1x08_P2.54mm_Vertical.kicad_mod create mode 100644 Fireball/Fireball.kicad_prl create mode 100644 Panels/title_test_18.stl create mode 100644 Panels/dual_vca.scad FN = 100; // [1:1:360] HP = 5.07; // 5.07 for a single 1 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-4110, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator connector Molex CLIK-Mate series connector, S11B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP.

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