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ICS-43434 TDK InvenSense Knowles MEMS I2S Microphone: https://invensense.tdk.com/products/ics-43434/ microphone MEMS I2S Microphone: https://www.knowles.com/subdepartment/dpt-microphones/subdpt-sisonic-surface-mount-mems microphone MEMS I2S Microphone: https://www.knowles.com/subdepartment/dpt-microphones/subdpt-sisonic-surface-mount-mems microphone MEMS I2S SPH0645LM4H Knowles Sensirion, SHT40, SHT41, SHT45, DFN, 4 Pin (https://www.onsemi.com/pub/Collateral/MDB8S-D.PDF#page=4), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BA), generated with kicad-footprint-generator Harting har-flexicon series connector, B13B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-120-02-xxx-DV-LC, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 14-Lead Plastic Thin Shrink Small Outline (SS)-5.30 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 505AB (see ON Semiconductor 506CM.PDF DFN, 14 Pin (http://www.st.com/resource/en/datasheet/lsm303dlhc.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-128-02-xxx-DV-BE, 28 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1510, with PCB locator, 2 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0910, with PCB locator, 12 Pins.

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