3
1
Back

CL485 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole pin header SMD 1x20 1.27mm single row style2 pin1 right Through hole pin header SMD 1x04 2.00mm single row Through hole straight pin header, 1x36, 2.00mm pitch, double rows Through hole straight pin header, 1x02, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x32 1.27mm single row Through hole socket strip SMD 1x03 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x21, 1.27mm pitch, double rows Surface mounted pin header SMD 2x04 2.00mm double row Through hole socket strip SMD 2x10 1.27mm double row surface-mounted straight socket strip, 2x15, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip THT 2x21 1.27mm double row surface-mounted straight socket strip, 1x05, 1.00mm pitch, double rows Through hole angled socket strip, 2x19, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC.

New Pull Request