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90814-0018, 18 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator JST VH series connector, B18B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-05A example for new part number: 09-65-2038, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-142-02-xxx-DV-BE-LC, 42 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0106, With thermal vias in pads, 2 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B10B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (http://www.macronix.com/Lists/Datasheet/Attachments/7534/MX25R3235F,%20Wide%20Range,%2032Mb,%20v1.6.pdf#page=79), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B10P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-U (6032-15 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator JST VH series connector, SM04B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-16DP-2DSA, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1530, 15 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FF0871SA1, 71 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ108178.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON-10 package 2x3mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 9x9mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.8mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 9x9mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.6mm.

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