Labels Milestones
Back(375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf.
- 0.172853 0.984699 vertex 7.39621 0.0908976 6.86711.
- V81 BGA-81 Altera BGA-100.
- 7.92322 vertex -1.06427 -7.18483 7.92316 vertex 4.28775.
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