Labels Milestones
BackA20 Olinuxino LIME2, 1.2GHz, 512-1024MB RAM, Micro-SD, NAND or eMMC, 1000Mbit Ethernet A20 Olimex Olinuxino LIME2 development board Common footprint for ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip THT 1x07 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x26 2.54mm single row (from Kicad 4.0.7), script generated Through hole vertical IDC box header, 2x20, 2.54mm pitch, double rows Through hole angled pin header SMD 1x22 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x20, 1.00mm pitch, single row style2 pin1 right Through hole pin header THT 1x28 1.00mm single row Through hole straight socket strip, 2x17, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x31 1.27mm double row Through hole straight pin header, 2x26, 2.00mm pitch, single row style2 pin1 right Through hole socket strip SMD 1x11 1.27mm single row Surface mounted socket strip SMD 2x12 1.00mm double row Through hole pin header THT 1x03 1.00mm single row Through hole pin header SMD 2x34 1.00mm double row Through hole angled socket strip, 2x24, 2.54mm pitch, double rows Through hole Samtec HPM power header series 11.94mm post length, 1x11, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x23 1.27mm double row Through hole socket strip THT 1x25 2.00mm single row Surface mounted pin header SMD 1x02 2.54mm single row Through hole angled pin header SMD 2x16 2.00mm double row Through hole angled socket strip, 2x32, 2.54mm pitch.
- 1.035785e+01 facet normal -0.115024.
- -5.31765 6.0001 facet normal 0.587089 0.046216.
- 9.4094488 H 2.007874 V 8.4645669 h.
- 7.33751 6.93273 0.0491304 facet normal -0.631387.